Yang Wang is a seasoned technology leader with nearly two decades of experience in software engineering. In 2023, Yang co-founded Tensec, where she leads technology and pursues her passion for building innovative fintech solutions. Prior to Tensec, Yang was the Head of Product Engineering at Bond Financial Technology and was pivotal to the launch of Bond’s cloud-based BaaS platform and Brand Portal. Before Bond, she was the engineering manager at Credit Karma and led the expansion into the UK market. Yang holds a Master’s in Computer Science from Purdue University.